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2025-08Packaging and testing involves dicing, wire bonding, and plastic encapsulating qualified wafers. This ensures electrical connections between the chip circuits and external devices, provides mechanical and physical protection for the chip,...
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2025-081. Introduction to SF6GasSF6is chemically stable, does not decompose at temperatures between 500°C and 600°C, and is unreactive with acids, alkalis, salts, ammonia, and water. Under the influence of an electric arc (at several th...
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2025-08In the field of ambient temperature measurement for integrated MEMS chips, thermistors, thermopiles, and PN junctions are the three mainstream technologies. Thermistors utilize the constant temperature-resistance coefficient of a th...
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2025-08As one of the three pillars of modern information technology, sensors play a vital role in the fields of Internet of Things, intelligent manufacturing, intelligent transportation, medical health, etc. With the continuous advancement of ...
